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Tokuyama EE-Bond
The adhesion specialist! Maximum effectiveness in only 2 steps.
Dental adhesive system specifically designed for enamel etching technique, which is considered the ideal approach to obtain a good seal of margins and appropriate resin tag infiltration into the dentin. These features help to ensure the aesthetics of the margins in the long term and minimize post-operative sensitivity, associating force of adhesion to tooth structure, providing greater integrity to the dentin.
Bonding of light or dual-cured composite to:
- cut/uncut enamel
- cut/uncut dentin
- fractured porcelain/composite repair
- Outstanding adhesion performance
- Dependable marginal integrity (minimized micro-leakage)
- Less post-operative sensitivity
- Perfectly sealed cavities
- Lower technique-sensitivity
- Fluoride-releasing
- Extra fine dispensing tip
- Thixotropic gel that remains where placed
- Easy to visualize and rinse
After preparing the cavity, apply the etching gel (Tokuyama Etching Gel HV) on the enamel parts of the cavity and wait 5 or more seconds. Rinse thoroughly for at least 10 seconds with a water jet under suction. Dry the surfaces with a mild air jet (indirectly). Apply the appropriate amount of Tokuyama EE-Bond on the surfaces with a brushing motion, wait 10 seconds, dry for 10 seconds, of which the first 5 indirectly, light-cure for 10 or more seconds.
Ref. 14111 | Tokuyama EE-Bond Intro Kit:
• 1 bottle, 5.0ml
• 25 applicators
• 1 mixing well
• 1 syringe Tokuyama Etching Gel HV, 2.5ml
• 10 tips for syringe
Ref. 14103 | Tokuyama Etching Gel HV Syringe: 2 syringes Tokuyama Etching Gel HV 2.5ml each, 20 tips
Ref. 14104 | Tokuyama Etching Gel HV Tip: 50 tips
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