Tokuyama EE-Bond

The adhesion specialist! Maximum effectiveness in only 2 steps.

Dental adhesive system specifically designed for enamel etching technique, which is considered the ideal approach to obtain a good seal of margins and appropriate resin tag infiltration into the dentin. These features help to ensure the aesthetics of the margins in the long term and minimize post-operative sensitivity, associating force of adhesion to tooth structure, providing greater integrity to the dentin.

Bonding of light or dual-cured composite to:

  • cut/uncut enamel
  • cut/uncut dentin
  • fractured porcelain/composite repair
  • Outstanding adhesion performance
  • Dependable marginal integrity (minimized micro-leakage)
  • Less post-operative sensitivity
  • Perfectly sealed cavities
  • Lower technique-sensitivity
  • Fluoride-releasing
  • Extra fine dispensing tip
  • Thixotropic gel that remains where placed
  • Easy to visualize and rinse

After preparing the cavity, apply the etching gel (Tokuyama Etching Gel HV) on the enamel parts of the cavity and wait 5 or more seconds. Rinse thoroughly  for at least 10 seconds with a water jet under suction. Dry the surfaces with a mild air jet (indirectly). Apply the appropriate amount of Tokuyama EE-Bond on the surfaces with a brushing motion, wait 10 seconds, dry for 10 seconds, of which the first 5 indirectly, light-cure for 10 or more seconds.

Ref. 14111 | Tokuyama EE-Bond Intro Kit:
• 1 bottle, 5.0ml
• 25 applicators
• 1 mixing well
• 1 syringe Tokuyama Etching Gel HV, 2.5ml
• 10 tips for syringe

Ref. 14103 | Tokuyama Etching Gel HV Syringe: 2 syringes Tokuyama Etching Gel HV 2.5ml each, 20 tips

Ref. 14104 | Tokuyama Etching Gel HV Tip: 50 tips

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Tokuyama EE-Bond

The adhesion specialist! Maximum effectiveness in only 2 steps.